Fluorescence based thermometry for packaging applications

ABSTRACT

Methods and apparatus for measuring the temperature of epoxy resin in an electronics package are provided herein. In some embodiments, apparatus for encapsulating an electronics package includes: a process chamber having a chamber body enclosing a processing volume; a substrate support having a support surface for receiving and supporting a substrate for forming an electronics package; and a temperature sensor to measure a temperature of an epoxy resin in an electronics package. The temperature sensor includes: an input apparatus including at least a light source disposed outside the chamber body to provide an excitation light energy to a portion of the epoxy resin; and an output apparatus including at least a signal analyzer disposed outside the chamber body to detect fluorescent light energy emitted by the portion of the epoxy resin and determine a temperature of the epoxy resin based on the excitation light energy and the fluorescent light energy.

CROSS-REFERENCE TO RELATED APPLICATIONS

The present application is a divisional application of U.S. patentapplication Ser. No. 15/585,842, filed on May 3, 2017, the entirecontents of which is herein incorporated by reference,

FIELD

Embodiments of the present disclosure generally relate to electronicsmanufacturing.

BACKGROUND

Epoxy resin formulations are excellent electrical insulators and protectelectrical components from short circuiting, dust and moisture. In theelectronics industry, epoxy resins are the primary resin used inpackaging electronics in the manufacture of printed circuit boards,integrated circuits, transistors, hybrid circuits, and the like.

Electronics packaging typically includes using an epoxy resin toencapsulate one or more polymer layers having dies and dielectric ormetal circuit interconnectors. Current epoxy encapsulating methodsinclude temperature-sensitive processes such as curing, pre-cleaning,and degassing necessary to remove moisture and improve the materialproperties of the package.

These temperature-sensitive processes are conventionally carried out attemperatures that may range from about 100° C. to about 200° C. The typeof heat used depends on the requirements of the temperature-sensitiveprocess and particular application of the electronics package.Typically, one or more heat sources provide resistive, convective,radiative, or microwave heating, as desired for thetemperature-sensitive process or electronics package application. Thetemperature of the epoxy is typically measured, monitored and,controlled during each heating process in order to ensure high qualitycleaning, moisture removal, and process uniformity. Throughput isnormally enhanced by performing the temperature-sensitive processes onbatches of multiple packages. Currently available temperature measuringtechniques include contact thermometry and non-contact thermometry usinginfrared pyrometers. However, the inventors have discovered that thecurrently available temperature measuring techniques fail to accuratelyand reliably measure the temperature. The inventors have furtherdiscovered that the currently available temperature measuring techniquesinadequately measure the temperature during the processing of a batch ofmultiple packages.

Therefore, the inventors have provided improved apparatus and methodsfor measuring, monitoring and controlling the temperature duringpackaging.

SUMMARY

Methods and apparatus for measuring the temperature of epoxy resin in anelectronics package are provided herein. In some embodiments, apparatusfor encapsulating an electronics package includes: a process chamberhaving a chamber body enclosing a processing volume; a substrate supporthaving a support surface for receiving and supporting a substrate forforming an electronics package; and a temperature sensor to measure atemperature of an epoxy resin in an electronics package. The temperaturesensor includes: an input apparatus including at least a light sourcedisposed outside the chamber body to provide an excitation light energyto a portion of the epoxy resin; and an output apparatus including atleast a signal analyzer disposed outside the chamber body to detectfluorescent light energy emitted by the portion of the epoxy resin anddetermine a temperature of the epoxy resin based on the excitation lightenergy and the fluorescent light energy.

In some embodiments, a substrate for forming an electronics packageincludes: a body having an upper surface area; an array of microcircuitdies disposed in the body and substantially covering the upper surfacearea; and an epoxy resin disposed between adjacent microcircuit dies andalong the periphery of the body, away from the array of microcircuitdies.

In some embodiments, a method for measuring a temperature of an epoxyresin in an electronics package includes: (a) providing an excitationlight beam to a portion of an epoxy resin encapsulating an electronicspackage; (b) receiving a fluorescent light beam emitted from the portionof the epoxy resin; (c) measuring an emission energy, a wavelength, andan intensity of the fluorescent light beam; and (d) determining atemperature of the epoxy resin based on the excitation light beam andemitted fluorescent light beams.

Other and further embodiments of the present disclosure are describedbelow.

BRIEF DESCRIPTION OF THE DRAWINGS

Embodiments of the present disclosure, briefly summarized above anddiscussed in greater detail below, can be understood by reference to theillustrative embodiments of the disclosure depicted in the appendeddrawings. However, the appended drawings illustrate only typicalembodiments of the disclosure and are therefore not to be consideredlimiting of scope, for the disclosure may admit to other equallyeffective embodiments.

FIG. 1A depicts a schematic view of a process chamber including atemperature measuring apparatus in accordance with one or moreembodiments of the present disclosure.

FIG. 1B depicts a schematic view of another process chamber including atemperature measuring apparatus in accordance with one or moreembodiments of the present disclosure.

FIG. 2 is a schematic top view of an exemplary substrate for forming anelectronics package in accordance with one or more embodiments of thepresent disclosure.

FIG. 3 depicts a schematic side view of an exemplary microcircuit die inaccordance with one or more embodiments of the present disclosure.

FIG. 4 depicts a method of measuring a temperature of an epoxy resin ina substrate for forming an electronics package in accordance with someembodiments of the present disclosure.

To facilitate understanding, identical reference numerals have beenused, where possible, to designate identical elements that are common tothe figures. The figures are not drawn to scale and may be simplifiedfor clarity. Elements and features of one embodiment may be beneficiallyincorporated in other embodiments without further recitation.

DETAILED DESCRIPTION

Embodiments of the present disclosure provide improved measurement andmonitoring of the temperature of an epoxy resin used duringencapsulation of an electronics package. When using an epoxy resin toencapsulate an electronics package, temperature-sensitive processes suchas curing, pre-cleaning, and degassing are closely monitored and tightlycontrolled in order to prevent defects due to over-heating or poorprocess results due to under-heating. The disclosed methods andapparatus advantageously facilitate accurate and fast (e.g., real-time)measurements of the temperature of an epoxy resin during one or moretemperature sensitive processes used to encapsulate an electronicspackage. Accurate and fast thermometry improves process uniformity andmore rapid corrective intervention when there is a drift in the processand epoxy resin temperature.

FIG. 1A is a schematic view of an exemplary apparatus 100 including aprocess chamber incorporating a temperature measuring apparatus inaccordance with one or more embodiments of the present disclosure. Asshown in FIG. 1A, the exemplary apparatus 100 includes a process chamber102 having a chamber body 104 defined by sidewalls, a bottom portion,and a top portion. The chamber body 104 encloses a processing volume106.

A pedestal 108 is disposed in the processing volume 106. The pedestal108 includes a substrate support 110 having a support surface 112. Thesupport surface 112 is configured to receive and support a substrate,for example, a substrate 114 having one or more electronics packages 116formed or disposed on the substrate 114. Optionally, in someembodiments, the support surface 112 may be configured to support asubstrate carrier 118. The substrate carrier 118 is permeable to lightenergy. In some embodiments, the substrate carrier 118 may compriseglass. For example, the glass of the substrate carrier 118 may beconfigured to be transparent to light energy in the absorbed and emittedradiation wavelength bands of fluorescence materials contained in theone or more electronics packages 116 (e.g. epoxy resin 206 and/or dopant208, discussed below)

In some embodiments, the chamber body 104 may include an opening 119(e.g., a slit valve opening) formed through one of the sidewalls at aheight proximate the substrate support 110 to facilitate the ingress andegress of one or more substrates 114 into the processing volume 106, forexample, onto and off the support surface 112. In some embodiments, theopening 119 may be retractably sealable, for example, to control thepressure and temperature conditions of the processing volume 106.

In some embodiments, the process chamber 102 may include a heat source120 disposed about the chamber body 104 or in the processing volume 106.In the exemplary embodiment depicted in FIG. 1A, a heat source 120 isdisposed in the pedestal 108. In some embodiments, the heat source 120may be a resistive heater, a convective heater, a radiative heater, or amicrowave heater, or a combination of two or more types of heaters. Insome embodiments, the chamber body 104 may be configured to receive andradiate microwave, convective, or other similar kinds of heat energyfrom one or more heat sources 120 disposed outside the chamber body 104.In some embodiments, a resistive heat source disposed in the pedestal108 may be used in combination with one or more radiative microwave orconvective heating sources disposed about the chamber body 104, asillustrated in FIG. 1A. In some embodiments, a resistive heat sourcedisposed in the pedestal 108 may be the only heat source provided, forexample, if the provided one or more electronics packages 116 includeuncovered fluorescence materials (e.g. epoxy resin 206 and/or dopant208, discussed below).

A first window 122 and a second window 124 are formed in the chamberbody 104. The first window 122 is provided for the ingress of lightenergy into the processing volume 106. The second window 124 is providedfor the egress of light energy out of the processing volume 106. In someembodiments, one window is provided and light energy can enter and leavethe processing volume 106 through the one window. In some embodiments,the first window 122 and the second window 124 are disposed in the samepart of the chamber body 104. In the exemplary embodiment depicted inFIG. 1A, both the first and second windows 122, 124 are disposed in asidewall of the chamber body 104.

Either or both of the first and second windows, or a single window, maybe provided in other suitable locations to facilitate light energyentering and leaving the processing volume in the manner as disclosedherein. In some embodiments, the first and second windows 122, 124 maybe respectively disposed in oppositely facing sidewalls. In someembodiments, one of the first and second windows 122, 124 may bedisposed in the bottom of the chamber body 104 and the other one of thefirst and second windows 122, 124 may be disposed in a sidewall of thechamber body 104. In some embodiments, both of the first and secondwindows 122, 124 may be disposed in the bottom of the chamber body 104.

A temperature sensor 126 is provided outside the process chamber. Thetemperature sensor 126 includes an input apparatus 128. The inputapparatus 128 includes at least a light source 130 disposed outside thechamber body 104. The light source 130 is provided to deliver light tothe processing volume 106, through the first window 122. The temperaturesensor 126 further includes an output apparatus 132. The outputapparatus 132 includes at least a signal analyzer 134 disposed outsidethe chamber body 104. The signal analyzer is provided to receive andanalyze light signals from the processing volume 106, through the secondwindow 124.

In some embodiments, for example as illustrated in FIG. 1A, the inputapparatus 128 includes a first optical conduit 136 disposed through thefirst window 122. The first optical conduit 136 provides an opticalpathway to light energy from the light source 130 into the processingvolume 106 (e.g., to the underside of the substrate 114 of theelectronics package 116, when present). The first optical conduit 136further includes a first receiving end 138 and a first delivery end 140opposite the first receiving end 138. The first optical conduit 136 canbe made of a fiber optic material.

The first optical conduit 136 is operatively coupled to the light source130. The light source 130 is configured to provide light energy having awavelength between about 360 nm and about 400 nm, for example, about 385nm. In some embodiments, the light source 130 may be an ultraviolet (UV)light excimer laser.

The first receiving end 138 is positioned to receive light from thelight source 130. The first delivery end 140 is positioned to deliverlight energy to the processing volume 106 (e.g., to the underside of thesubstrate 114 of the electronics package 116, when present). As depictedin FIG. 1A, the first delivery end 140 is disposed inside the processingvolume 106.

In some embodiments, for example as illustrated in FIG. 1A, the outputapparatus 132 includes a second optical conduit 142 disposed through thesecond window 124. The second optical conduit 142 provides an opticalpathway to light signals leaving the processing volume 106 (e.g., fromthe underside of the substrate 114 of the electronics package 116, whenpresent) for delivery to the signal analyzer 134. The second opticalconduit 142 includes a second receiving end 144 and a second deliveryend 146 opposite the second receiving end 144. The second opticalconduit 142 is made of a fiber optic material.

The second receiving end 144 is positioned to receive light from theprocessing volume 106 (e.g., from the underside of the substrate 114 ofthe electronics package 116, when present). The second delivery end 146is positioned to deliver light signals to the signal analyzer 134.

The input apparatus further includes a first optics arrangement 148disposed between the light source 130 and the first window 122configured to collect, guide, and focus light provided by the lightsource 130 towards the first window 122. In some embodiments, the firstoptics arrangement 148 includes light prisms and lenses. A first lightcarrier 150 couples the light source 130 to the first optics arrangement148. In some embodiments, the first light carrier 150 may be made of afiber optic material. For example, the first light carrier 150 may be afiber optic cable or a flexible fiber optic light pipe. In someembodiments, for example, as depicted in FIG. 1A, the first opticsarrangement 148 directs the light from the light source 130 to the firstreceiving end 138 of the first optical conduit 136.

The output apparatus further includes a second optics arrangement 152disposed proximate the second window 124 configured to collect lightemitted from an irradiated area inside the processing volume 106 (e.g.,the underside of the substrate 114 of the electronics package 116, whenpresent). In some embodiments, for example, as depicted in FIG. 1A, thesecond optics arrangement is disposed proximate the second receiving end144 of the second optical conduit 142. In some embodiments, the secondoptics arrangement 152 include light prisms and lenses.

The output apparatus further includes a filtering element 154. Thefiltering element 154 is coupled to the second delivery end 146 anddisposed between the second delivery end 146 and a third opticsarrangement 156. The filtering element 154 is provided to block thereflectance component and allow the fluorescence component of the lightemitted from an irradiated area inside the processing volume 106. Insome embodiments, the filtering element 154 may be made of quartz. Insome embodiments, the quartz filter may be doped with chemicalcompositions to allow the filter to block light waves based on apredetermined frequency.

The third optics arrangement 156 is disposed between the filteringelement 154 and the signal analyzer 134 and is configured to collect andfocus fluorescence light into the signal analyzer 134. In someembodiments, third optics arrangement 156 includes light prisms andlenses. A second light carrier 158 couples the third optics arrangement156 to the signal analyzer 134. In some embodiments the second lightcarrier 158 may be made of a fiber optic material. For example, thesecond light carrier 158 may be a fiber optic cable or a flexible fiberoptic light pipe.

The signal analyzer 134 comprises a fluorescence spectrophotometer(fluoro-spectrometer). The fluoro-spectrometer is configured to read andperform a spectral analysis on the fluorescence light signals.

In some embodiments, as depicted in FIG. 1B, the process chamber 102 mayinclude a multiple substrate holder 160 configured to support multiplesubstrates in a vertically spaced apart configuration (e.g., substrates114 a, 114 b, and 114 c of electronics packages 116 a, 116 b, and 116c). As depicted in FIG. 1B the multiple substrate holder 160 may be usedwithout the substrate support 110 or any part of the pedestal 108.Although FIG. 1B shows one exemplary configuration, teachings of thepresent disclosure may be adapted for multiple substrate holders havingother configurations as well, for example, in combination with thepedestal 108 and/or the substrate support 110.

The multiple substrate holder 160 includes one or more vertical supports162. In some embodiments, the vertical supports 162 may be supported bythe bottom of the chamber body 104, for example via one more couplingelements such as fastening screws or the like. In some embodiments, forexample, as depicted in FIG. 1B, the multiple substrate holder 160optionally includes a bottom member 164 coupled to the one or morevertical supports 162 and for supporting the one or more verticalsupports 164 (one vertical support 162 is shown in FIG. 1B). Thevertical supports 162 further include a plurality of peripheral members(e.g., peripheral members 166 a, 166 b, and 166 c) extending radiallyinward from the vertical supports 162. In some embodiments, for example,as shown in FIG. 1B, each peripheral member may include stepped portion168 for receiving and supporting the substrate 114.

In some embodiments, for example as depicted in FIG. 1B, the pluralityof peripheral members (e.g., peripheral members 166 a, 166 b, 166 c) maybe configured to support respective substrates (e.g., substrates 114 a,114 b, 114 c) supported and transported by substrate carriers (e.g.,substrate carriers 118 a, 118 b, 118 c). In some embodiments, theperipheral members (e.g., peripheral members 166 a, 166 b, 166 c) areconfigured to directly hold and support the respective substrates (e.g.,substrates 114 a, 114 b, 114 c).

The multiple substrate holder 160 further includes a lift assembly 170.The lift assembly 170 may include one or more of a motor, an actuator,or the like, to control the vertical position of the peripheral members(e.g., peripheral members 166 a, 166 b, 166 c). The vertical position ofthe peripheral members (e.g., peripheral members 166 a, 166 b, 166 c) iscontrolled for placing and removing each substrate carrier (e.g.,substrate carriers 118 a, 118 b, 118 c) and/or substrate (e.g.,substrates 114 a, 114 b, 114 c) through the opening 119 and onto or offof the substrate support.

A plurality of temperature sensors 126 (e.g., as described with respectto FIG. 1A) may be provided, each temperature sensor corresponding toone of multiple locations to be in the processing volume 106 (e.g., theunderside of each substrate 114 a, 114 b, and 114 c when provided anddisposed on peripheral members 166 a, 166 b, and 166 c as depicted inFIG. 1B). Although, FIG. 1B depicts one temperature sensor 126, whenduplicate temperature sensors are provided, a corresponding plurality offirst and second optical conduits 136, 142 are disposed through aplurality of respective pairs of first and second windows 122, 124. Therespective pairs of first and second windows 122, 124 are formed inlocations on the chamber body 104 (e.g., through the sidewalls and/orbottom of the chamber body 104) to allow delivery of light to andreceipt of light from each location (e.g., the underside of eachsubstrate 114 a, 114 b, and 114 c) when provided and disposed onperipheral members 166 a, 166 b, and 166 c).

In some embodiments, a single light source 130 may be used to supplylight to the respective locations. For example, in some embodiments, thefirst optics arrangement may include an optical splitter for splittingthe excitation light beam into multiple excitation light beams that areeach directed to each first window 122. In some embodiments, the opticalsplitter may include partially coated reflectors to split the excitationlight beam and light prisms to direct the excitation light to thevarious substrate locations after splitting. In some embodiments, asingle signal analyzer 134 may be used to read and perform a spectralanalysis of the fluorescence light from the multiple locations (e.g.,from the underside of each substrate 114 a, 114 b, and 114 c) whenprovided and disposed on peripheral members 166 a, 166 b, and 166 c).

FIG. 2 depicts an exemplary substrate 114 of the electronics package116. For example, in some embodiments, the substrate 114 may be asilicon wafer. In some embodiments, the substrate 114 may comprise oneor more polymers or metals suitable for electronics packagingapplications. As shown in FIG. 2, the substrate 114 is disposed thesubstrate carrier 118 discussed above and shown in FIGS. 1A and 1B. Thesubstrate 114 has a body 202 having an upper surface area and an arrayof microcircuit dies 204 disposed on the body 202. An epoxy resin 206 isprovided to create insulation between adjacently disposed microcircuitdies 204 and encapsulate the body 202. In some embodiments, the array ofmicrocircuit dies 204 substantially covers the upper surface area of thebody 202 (e.g., leaving only relatively small spaces between adjacentdies and an outer peripheral area of the upper surface area uncovered).In some embodiments, one or more portions of the body 202 having theepoxy resin 206 exclude the microcircuit dies 204. For example, in someembodiments, areas along the periphery of the body 202 may include theepoxy resin 206 and exclude the microcircuit dies 204.

The thickness of the epoxy resin 206 may be between about 600micrometers to 900 micrometers depending on the amount of tolerablewarpage for the material composition of epoxy. In some embodiments, theepoxy resin 206 may have a glass transition temperature between about140° C. and about 150° C. When provided, the substrate carrier 118 andthe epoxy resin have a substantially similar coefficient of thermalexpansion (CTE) (e.g., one CTE is no more than 10 percent different thanthe other CTE).

In some embodiments, the epoxy resin 206 may include a dopant 208. Insome embodiments, for example as shown in FIG. 2, the dopant may be inthe areas along the periphery of the body 202 including the epoxy resin206, away from the array of microcircuit dies 204.

The dopant 208 enhances the fluorescence of the epoxy resin 206.Enhancing the fluorescence of the epoxy resin 206 in turn improvesdetection sensitivity of fluorescence light emitted by the epoxy resin206 when radiated with an excitation light beam. In some embodiments,the epoxy resin 206 may be coated with the dopant 208, for example, thedopant 208 may be applied as a surface paint over the epoxy resin 206.Alternatively or in combination, the dopant 208 may be embedded in theepoxy resin 206, for example, the dopant 208 may be added during thesynthesis of the epoxy resin 206.

The dopant 208 may be an organic or inorganic compound having a higherquantum yield relative to the epoxy resin 206 to ensure that thefluorescence of the epoxy resin 206 is enhanced. In some embodiments,the dopant 208 may comprise one or more temperature-sensitivefluorescent compounds selected from a list comprising polycyclicaromatic hydrocarbon compounds (PAHs), bis-byrene propane, benzoxazolylstilbene (BOS), perylene, bis 2,5-tert-butylphenyl perylenedicarboximide(BTBP), 1-(4-dimethylaminophenyl)-6-phenyl-1,3,5-hexatriene (DMA-DPH),9,10-diphenylanthracene (DPA), rhodamine, dichlorofluorescein,sulforhodamine B, 4,4′-diamino-2,2′-stilbenedisulfonic acid, 44′-bis(benzoxazolyl)-cis-stilbene and 2 5-bis(benzoxazol-2-yl)thiophene.

In some embodiments, the individual dies of the array of microcircuitdies 204 may be identical. In other embodiments, the individual dies ofthe array of microcircuit dies 204 may differ from each other. In someembodiments, the individual dies of the array of microcircuit dies 204may be configured for use, for example, in memory, logic, communication,and sensing applications, although the microcircuit dies can begenerally used in any application.

FIG. 3 depicts an exemplary die 300 of the exemplary array ofmicrocircuit dies 204. The die 300 includes one or more chips 302 havinga bottom, a top, and sides between the top and the bottom. For example,the chip 302 may be a memory chip, a logic chip, a communication chip,or a sensor. In some embodiments, the bottom and sides of the chip 302are embedded in the epoxy resin 206 such that the epoxy resin 206provides insulation between the chips 302 of the same or anotheradjacently disposed die 300.

As shown in FIG. 3, each chip 302 includes one or more contact pads 304formed on a side of the chip 302. The one or more contact pads 304 arecoupled to a single one of one or more conductive traces 306 disposed ina redistribution layer (RDL) 312 (two RDLs 312 shown in FIG. 3).However, depending on the electronics application, in some embodimentsthe contact pads may be coupled to more than one of the conductivetraces 306 disposed in the RDLs 312. In some embodiments, the contactpads 304 may be an input/output system for providing communicationbetween an information system including the die 300 and anotherinformation processing system. The contact pads 304 are made of metal,for example, aluminum, copper, tungsten, or the like.

Each conductive trace 306 corresponding to each chip 302 is coupled toand extends from one or more locations of the chip 302 having thecontact pads 304. For example, as shown in FIG. 3, each conductive trace306 extends from two contact pads 304 of the respective chips 302. Theconductive traces 306 are made of metal. The RDL 312 further includes apolymer layer 308 provided to substantially enclose the conductive trace306. One or more portions of the conductive traces 306 across the top ofthe polymer layer 308 are exposed.

The exposed portions of the conductive traces 306 are provided forexternally interconnecting the die 300 to other circuits and electroniccomponents in an assembly including the die 300. In some embodiments, asolder bump 310 may be disposed on exposed portions of the conductivetraces 306. The solder bumps 310 are provided to receive one or moreexternal interconnect wires and form a permanent bond between the one ormore external interconnect wires, the conductive traces 306 of the RDLs312, and ultimately to the microcircuit dies 204.

In encapsulating the electronics package 116, the electronics package116 undergoes one or more temperature-sensitive processes such aspre-cleaning, curing, and degassing. The inventors have discoveredprocess results are improved by accurately and reliably measuring andcontrolling the temperature of the epoxy resin 206 in the substrate 114of the electronics package 116.

To measure the temperature of the epoxy resin 206 of a substrate 114 ofan electronics package 116, the light source 130 provides an excitationlight beam to the epoxy resin 206 (and/or dopant 208, when present) onthe underside of the substrate 114, as illustrated by directional arrow172 in FIG. 1A. The excitation light beam leaving the light source 130is carried by the first light carrier 150 and directed to the firstoptics arrangement 148. The first optics arrangement 148 focuses theexcitation light beam into the first receiving end 138 of the firstoptical conduit 136. The excitation light beam propagates the length ofthe first optical conduit 136 and exits through the first delivery end140. The excitation light strikes the epoxy resin 206 (and/or dopant208, when present).

Upon excitation, the epoxy resin 206 (and/or dopant 208, when present)produces an emission light beam comprising fluorescence and reflectancelight components. The emission light beam is directed to the secondreceiving end 144 of the second optical conduit 142, as illustrated bydirection arrow 173 in FIG. 1A. The second optics arrangement 152focuses the emission light into the second receiving end 144. Theemission light propagates in the second optical conduit 142 and exitsthrough the second delivery end 146 into the filtering element 154.

The filtering element 154 blocks the reflectance component and allowsthe fluorescence component of the emission light. The fluorescence lightis carried by the second light carrier 158 and directed to the thirdoptics arrangement 156. The third optics arrangement 156 focuses thefluorescence light into the signal analyzer 134.

The signal analyzer 134 measures the emission energy, a wavelength, andan intensity of the fluorescent light to reconstruct a light energyspectrum of the fluorescence light. The signal analyzer 134 compares thelight energy spectrum of the fluorescence light to the light energyspectrum of the excitation light and performs a standard calculation todetermine the temperature of the epoxy resin 206.

FIG. 4 depicts a flow chart for a method 400 of measuring a temperatureof the epoxy resin 206 in a substrate 114 of an electronics package 116in accordance with some embodiments of the present disclosure. Themethod 400 is described below with respect to FIG. 1A. The method mayadvantageously provide accurate, robust, and real-time temperaturemeasurement of one or more electronics packages disposed in a processchamber.

The method 400 begins at 402 by loading an electronics package into theprocess chamber and onto the substrate support. Optionally, as shown at404, temperature-sensitive processing may be started in the processchamber 102. At 406, a portion of an epoxy resin 206 in an electronicspackage is irradiated with an excitation light beam. At 408, afluorescent light beam is emitted from the portion of the epoxy resin206. At 410, the fluorescent light beam is transmitted to the signalanalyzer 134. At 412, a temperature of the epoxy resin 206 is determinedfrom a spectral analysis of excitation and emitted fluorescent lightbeams.

In some embodiments, determining the temperature of the epoxy resin at412 may include reference to a look-up table based on a systemcalibration optionally performed before beginning the method 400. Forexample, the system calibration may include repeating (a)-(d) for eachepoxy resin selected from a group of epoxy resins to develop atemperature reference look-up table for the group of epoxy resins. Thus,at 412, the accuracy of the measurement can be verified by comparing thedetermined temperature to the reference temperature. Alternatively, insome embodiments, the calibration process may be performed ex-situ.

The method 400 is similarly used to measure the temperature of the epoxyresin 206 in each substrate of each electronics package in a batch ofmultiple electronics packages (e.g., substrates 114 a, 114 b, and 114 cdepicted in FIG. 1B) in accordance with some embodiments of the presentdisclosure.

Returning to FIGS. 1A and 1B, a controller 174 may be provided andcoupled to various components of the process chamber 102 to control theoperation of the process chamber 102. The controller 174 includes acentral processing unit (CPU) 176, support circuits 178 and a memory orcomputer readable medium 180. The controller 174 may control the heatsource 120 and/or temperature sensor 126 directly, or via computers (orcontrollers) associated with particular process chamber and/or supportsystem components. The controller 174 may be any form of general-purposecomputer processor that can be used in an industrial setting forcontrolling various chambers and sub-processors. The memory, or computerreadable medium, 180 of the controller 174 may be one or more of readilyavailable memory such as random access memory (RAM), read only memory(ROM), floppy disk, hard disk, optical storage media (e.g., compact discor digital video disc), flash drive, or any other form of digitalstorage, local or remote. The support circuits 178 are coupled to theCPU 176 for supporting the processor in a conventional manner. Thesecircuits include cache, power supplies, clock circuits, input/outputcircuitry and subsystems, and the like. Inventive methods as describedherein, such as the method for measuring a temperature of a substrate,may be stored in the memory 180 as software routine 182 that may beexecuted or invoked to control the operation of the heat source 120and/or temperature sensor 126 in the manner described herein. Thesoftware routine may also be stored and/or executed by a second CPU (notshown) that is remotely located from the hardware being controlled bythe CPU 176.

Thus, improved non-contact fluorescence based epoxy temperaturemeasuring apparatus and methods have been provided herein. The substratetemperature measuring systems disclosed herein provide accurate, robust,and real-time temperature measurements during one or more temperaturesensitive electronics manufacturing processes.

While the foregoing is directed to embodiments of the presentdisclosure, other and further embodiments of the disclosure may bedevised without departing from the basic scope thereof.

The invention claimed is:
 1. A substrate for forming an electronicspackage, comprising: a body having an upper surface area; an array ofmicrocircuit dies disposed in the body and substantially covering theupper surface area; an epoxy resin disposed between adjacentmicrocircuit dies and along a periphery of the body, away from the arrayof microcircuit dies one or more chips, wherein the one or more chipscomprise memory chips, logic chips, communication chips and sensors; aredistribution layer (RDL) comprising a polymer layer and one or moreconductive traces disposed through the polymer layer; and one or morecontact pads disposed on each of the one or more chips, wherein the oneor more contact pads are coupled to the one or more conductive traces ofthe RDL.
 2. The substrate of claim 1, wherein the epoxy resin furthercomprises a temperature-sensitive fluorescent compound is selected froma list comprising: polycyclic aromatic hydrocarbon compounds (PAHs),bis-byrene propane, benzoxazolyl stilbene (BOS), perylene, bis2,5-tert-butylphenyl perylenedicarboximide (BTBP),1-(4-dimethylaminophenyl)-6-phenyl-1,3,5-hexatriene (DMA-DPH),9,10-diphenylanthracene (DPA), rhodamine, dichlorofluorescein,sulforhodamine B, 4,4′-diamino-2,2′-stilbenedisulfonic acid, 44′-bis(benzoxazolyl)-cis-stilbene and 2 5-bis(benzoxazol-2-yl)thiophene.
 3. The substrate of claim 1, wherein the epoxy resin has aglass transition temperature of about 140° C. to about 150° C.
 4. Thesubstrate of claim 1, further comprising: one or more solder bumpscoupled to exposed portions of the one or more conductive traces.
 5. Thesubstrate of claim 1, wherein the epoxy resin provides insulationbetween the one or more chips of single or adjacently disposedmicrocircuits.
 6. The substrate of claim 1, wherein the one or morecontact pads are an input/output system for providing communicationbetween an information system including an individual die of the arrayof microcircuit dies and another information processing system.
 7. Thesubstrate of claim 1, wherein the one or more contact pads are made ofone of aluminum, copper, or tungsten.
 8. The substrate of claim 1,wherein areas along the periphery of the body include the epoxy resinand exclude the array of microcircuit dies.
 9. The substrate of claim 1,wherein a thickness of the epoxy resin is about 600 micrometers to about900 micrometers.
 10. The substrate of claim 1, wherein individual diesof the array of microcircuit dies are one of identical to each other ordifferent from each other.
 11. The substrate of claim 1, wherein thebody of the electronics package is encapsulated by the epoxy resin.